This adhesive adds nano-scale silver-coated copper conductive filler to achieve stable low-resistivity conductive performance, with no conductive performance attenuation after long-term use. It has excellent ceramic bonding strength and can firmly bond ceramic, metal and electronic component surfaces. It adopts a room temperature curing formula without complicated heating equipment, making operation simple and fast. It has passed RoHS environmental protection certification with no heavy metal precipitation, meeting the safety standards of the electronic industry, and solving the demand for integrated bonding and conductive transmission of ceramic electronic components.
Each piece is packaged in a 80ml two-component tube with a mixing ratio of A:B = 2:1. The operating temperature range is 15-30℃. It reaches usable strength after 18 hours of curing and maximum strength after 60 hours. It is black paste in appearance, with a density of 2.2 g/cm³, and a volume resistivity of 1.2×10^-3 Ω·cm. It has a shelf life of 10 months when unopened, and complies with IPC electronic assembly standards.
It is mainly used for conductive bonding of ceramic sensors, fixing ceramic carriers of electronic chips, connecting ceramic components of solar panels, conductive sealing of industrial electronic equipment and other scenarios. It is applicable to fields such as electronic appliances, semiconductors and new energy, realizing the dual functions of bonding and conductive transmission of ceramic components.
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