The core technical highlight of this adhesive is its use of zirconia ceramic particles, which have high hardness and excellent insulation performance, effectively isolating moisture and dust to protect precision electronic components. UV curing can achieve fast positioning in 30 seconds, improving production efficiency for mass manufacturing, while room temperature curing is suitable for complex small-batch assembly. It does not contain halogens or heavy metals, fully meeting EU environmental protection requirements, and will not corrode PCB boards or precision electronic components. Its high bonding strength can firmly fix tiny electronic components, ensuring the stability of precision electronic equipment.
This two-component adhesive has a mixing ratio of 1:1, with a density of 2.6g/cm³ and a viscosity of 5000cps. UV curing can form a cured layer in 30 seconds, while room temperature curing takes 24 hours to reach 80% of the final strength, with full strength achieved after 7 days. Its thermal conductivity is 0.8W/(m·K), and the working temperature range is from -55℃ to 150℃. It is packaged in 1kg per pack and 5kg per carton, and should be stored in a cool, dry environment at 2-8℃ to extend the storage period to 6 months.
It is mainly used for the packaging and fixing of precision electronic components, including semiconductor chip packaging, sensor sealing and fixing, PCB board component bonding, precision electronic instrument assembly, and aerospace electronic equipment insulation sealing. It can also be used for the repair of precision electronic equipment, such as mobile phone component fixing and wearable electronic device assembly, providing reliable insulation and protection for electronic products.
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