The core advantage lies in the ultra-high insulating performance, with a dielectric strength of more than 25KV/mm and a volume resistance of over 1×10^15Ω·cm, effectively isolating current and preventing signal interference. It cures at room temperature without additional heating equipment, reducing production costs and shortening the production cycle. The added high-purity ceramic particles ensure that the adhesive layer will not deform or age under long-term high-temperature working conditions, maintaining stable performance for more than 5 years. It also complies with UL94 V-0 flame retardant certification, meeting the safety requirements of electronic equipment production.
Packaged in 500g per sealed plastic bottle, with a milky white viscous liquid appearance. The viscosity is 5000±500 mPa·s at 25℃, and the curing time is 24 hours at room temperature to reach full strength. It has good fluidity, suitable for precision dispensing construction, and can fill small gaps of 0.1-2mm. The cured adhesive layer has a hardness of Shore D65, and the thermal conductivity is 0.8W/(m·K), meeting the heat dissipation requirements of electronic components. The packaging is a moisture-proof plastic bottle with a screw cap to prevent volatilization and deterioration.
Mainly applicable to the bonding and fixing of chips, capacitors, and resistors in the electronic manufacturing industry; the insulating sealing between PCB boards and ceramic substrates; the bonding of electronic device metal housings and sealing of instrument shells; and the repair of damaged insulating layers of electronic equipment. It is also suitable for the production of communication base station equipment, medical electronic instruments, and automotive electronic components, providing reliable insulating and bonding solutions for high-precision electronic products.
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