This product stands out with its ultra-fine 10-20nm silica particles, ensuring uniform dispersion and tight binding in semiconductor manufacturing processes. Its total impurity content is controlled below 10ppb, far exceeding the requirements of general industrial products. It adheres to the SEMI C8.1 standard, ensuring compatibility with automated semiconductor production lines. The stable pH value and viscosity ensure consistent application performance, reducing process defects and improving production efficiency. Unlike ordinary silica sol, meeting the cleanroom production requirements of semiconductor fabs.
The product has a solid content of 30±0.5wt%, with a viscosity range of 1.2-1.5mPa·s, suitable for precise dispensing and coating operations. The silica particle size is strictly controlled between 10-20nm, ensuring optimal binding strength and polishing effect. The pH value is maintained at 9.0-10.0, matching the requirements of most semiconductor manufacturing processes. It is packaged in 25kg HDPE drums to prevent contamination during storage and transportation. The shelf life is 12 months when stored at 5-30℃ away from direct sunlight. It complies with ISO14001 environmental management system standards and SEMI industry specifications, ensuring consistent quality across batches.
This high-purity silica sol is primarily used in advanced semiconductor manufacturing processes, including chemical mechanical polishing auxiliary agents, photoresist binding layers for wafer fabrication, and bonding materials for MEMS devices. It is also suitable for the production of high-end electronic packaging materials and optical coating components. Target industries include integrated circuit (IC) manufacturing, semiconductor packaging, MEMS device production, and optoelectronic component manufacturing. It is ideal for cleanroom-level production environments, meeting the strict purity requirements of leading chip fabrication plants worldwide.
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