This semiconductor grade ultra-pure silica sol is prepared by ion exchange and membrane filtration processes, with total metal impurities as low as less than 10ppb and a purity of up to 99.99%. It has uniform particle size distribution, which can achieve ultra-precision polishing of semiconductor wafer surfaces, with a Ra value of less than 0.1nm. It has excellent compatibility with lithium battery cathode materials (NCM, NCA), which can improve the cycle life and rate performance of the battery. It conforms to the SEMI S2 standard of the semiconductor industry, has no heavy metal residues, and will not cause leakage or short circuit of semiconductor devices.
The semiconductor grade ultra-pure silica sol has a solid content of 40.0%±0.5%, pH value of 9.3±0.2, average particle size of 25nm±3nm, kinematic viscosity of ≤5.8mPa·s at 25℃, and density of 1.25g/cm³±0.02. The total metal impurities are: Na≤5ppb, K≤3ppb, Fe≤2ppb, Ca≤2ppb. It is available in 10kg sterile food-grade plastic drums and 50kg stainless steel drums. The storage temperature should be controlled between 5℃ and 30℃, avoiding direct sunlight. It has a shelf life of 18 months and has passed ISO 9001, ISO 13485 and SEMI certifications, meeting the strict quality requirements of the semiconductor and lithium battery industries.
This ultra-pure silica sol is mainly used as a key component of chemical mechanical polishing (CMP) fluids for semiconductor wafers, and as a binder for lithium battery cathode materials to improve the bonding strength and flexibility of electrodes. It is widely used in the production of 8-inch and 12-inch semiconductor wafers, power lithium batteries, energy storage battery electrodes, as well as precision polishing of optical lenses and modification of semiconductor packaging materials, meeting the high-precision manufacturing requirements of the modern electronics and new energy industries.
Post RFQ
Chat
ALL CATEGORIES