The core highlight lies in the 8-zone flexible adjustable LED light source specially designed for flexible circuit boards, which can adapt to flexible substrates as thin as 0.05mm, avoiding substrate deformation or reflection problems caused by direct light from the light source. It is equipped with NVIDIA Jetson Nano AI processor, which can carry out accurate image matching and defect recognition for the irregular surface of flexible boards, with a detection speed of up to 120cm²/s and a detection accuracy of ±0.008mm, far exceeding the accuracy level of ordinary AOI equipment. The equipment is equipped with a special flexible substrate fixing fixture, which can fix flexible FPCs of different radian, avoiding substrate displacement during inspection, and supports one-click import of CAD files for comparative inspection, which can accurately locate the specific position and size of defects.
The detection accuracy is ±0.008mm, the maximum inspection speed is 120cm² per second, the compatible substrate size range is 30mm×30mm to 400mm×400mm, it uses an 8-zone flexible adjustable LED light source, the image processing system is NVIDIA Jetson Nano AI processor, equipped with a 17.3-inch industrial touch screen operating interface, supports Ethernet and USB3.0 communication interfaces, the power supply is 220V 50Hz single-phase AC, the overall equipment size is 1200mm in length × 800mm in width × 1400mm in height, and the net weight is 550kg. It is equipped with a special flexible substrate fixing fixture, supports automatic focus adjustment function, which can adapt to flexible substrates with a thickness of 0.05mm to 1mm, and has a function of automatic defect classification and marking.
It is mainly applicable to industries such as wearable device manufacturing, foldable smartphone production, flexible display module manufacturing, and medical flexible sensor production. Typical usage scenarios include quality inspection of flexible motherboards of foldable mobile phones, defect inspection of flexible circuit boards for smart watch straps, and circuit inspection of medical flexible electrode boards. It can identify folding wrinkles and adhesive overflow problems that cannot be found by traditional inspection equipment, helping manufacturers reduce the outflow rate of defective flexible boards and improve the reliability of products.
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