The core highlight lies in the dual light source system of 3D structured light and coaxial LED, which can obtain 2D images and 3D depth information at the same time, realizing all-dimensional defect detection, with a detection accuracy of up to ±0.005mm, making it one of the most accurate AOI equipment in the industry. It is equipped with NVIDIA Jetson AGX Xavier AI processor, which can realize real-time 3D image reconstruction and analysis, accurately identify the height and volume of solder joints and the three-dimensional position deviation of components, support one-click import of 3D CAD files for comparative inspection, and accurately locate the specific position and size of all 3D defects. It also has an automatic classification and report generation function, which can generate detailed 3D inspection reports for production managers to refer to.
The detection accuracy is ±0.005mm, the maximum inspection speed is 100cm² per second, the compatible substrate size range is 50mm×50mm to 450mm×450mm, it uses a 3D structured light + coaxial LED dual light source system, the image processing system is NVIDIA Jetson AGX Xavier AI processor, equipped with a 27-inch 4K industrial touch screen operating interface, supports three communication interfaces of Ethernet, PROFINET and OPC UA, the power supply is 380V 50Hz 3-phase AC, the overall equipment size is 2200mm in length × 1500mm in width × 1800mm in height, and the net weight is 1500kg. It is equipped with automatic loading and unloading devices, supports adaptive focus adjustment function, which can adapt to substrates of different thicknesses, and has a 3D image export and traceability function.
It is mainly applicable to industries such as aerospace electronics manufacturing, military electronics production, high-end automotive electronics assembly, and medical precision electronic equipment manufacturing. Typical usage scenarios include 3D solder joint inspection of aerospace PCB boards, three-dimensional component misalignment inspection of high-end automotive electronics, and cavity defect inspection of medical equipment precision circuit boards. It can identify 3D defects that cannot be found by traditional 2D AOI equipment, helping manufacturers meet the strict quality standards of high-end electronic products and improve the reliability and safety of products.
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