Equipped with 6 sets of 24MP microscopic industrial cameras to clearly capture the detail features of miniature components, the device supports recognition of 150+ common defects including missing components, wrong polarity, virtual soldering and size deviation. It supports two feeding modes: vibrating plate and tape and reel, adapting to mainstream small electronic component packaging specifications. Its compact body design enables flexible deployment in small SMT production lines or component packaging stations, and the visual operation interface reduces the threshold for operator use.
The overall machine dimensions are 1200mm(L)*800mm(W)*1500mm(H), with an operating weight of 320kg. It supports component packaging specifications from 01005 to 2020, with a detection accuracy of ±0.003mm and a maximum detection speed of 200 pieces per minute. It runs on 110/220V AC 50/60Hz power, with a working environment requirement of 15-30℃ temperature and 45-75% relative humidity without condensation. It supports USB 3.2 and industrial Ethernet data transmission, uses embedded Linux operating system, offers multilingual operation interfaces, and can store over 5,000 historical inspection reports with an automatic defective product sorting function.
It is mainly used for quality inspection of miniature surface-mounted electronic components and post-SMT soldering component detection, covering defects such as missing components, wrong polarity, solder joint defects and size deviation. It applies to consumer electronics, smart home, small industrial control equipment and automotive electronics miniature component production and assembly industries, and can be integrated into automated packaging lines or SMT production lines for online inspection, or used as independent inspection equipment for laboratory sampling.
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