The core highlight lies in the equipped with NVIDIA Jetson AGX Orin AI vision processor, which can realize millisecond-level image recognition and analysis, with a maximum detection speed of 180cm²/s, far higher than the industry average. It adopts a 5-zone adjustable coaxial LED light source, which can accurately identify defects on fine circuits and tiny solder joints, including more than 10 types of defects such as dry soldering, missing soldering, and component deviation. The equipment supports automatic loading and unloading on the production line without manual intervention, adapts to all kinds of PCB substrates from 50mm×50mm to 510mm×510mm, and can be seamlessly connected to existing SMT production lines. It also has a built-in data statistics and analysis module that can generate daily quality inspection reports, helping production managers optimize production processes and reduce the outflow rate of defective products.
Detailed technical parameters include a detection accuracy of ±0.01mm, a maximum inspection speed of 180cm² per second, a compatible substrate size range of 50mm×50mm to 510mm×510mm, a 5-zone adjustable LED coaxial light source, a NVIDIA Jetson AGX Orin AI visual processor as the image processing core, a 21.5-inch industrial touch screen operating interface, three communication interfaces of Ethernet, PROFINET and Modbus TCP, a power supply of 380V 50Hz 3-phase AC, an overall equipment size of 1800mm in length × 1200mm in width × 1600mm in height, and a net weight of 850kg. It supports automatic scanning to identify the substrate model and call the corresponding detection program, and has an automatic calibration function to regularly correct the detection accuracy.
It is mainly suitable for high-volume SMT PCB production lines, and applicable industries include consumer electronics manufacturing, communication base station equipment production, automotive electronics PCB mass production, computer hardware manufacturing and other fields. Typical usage scenarios include online quality inspection of smartphone motherboards, solder joint inspection of computer graphics card PCBs, and component misalignment inspection of communication module circuit boards. It can be seamlessly integrated into the factory MES system to realize real-time upload and traceability of production data, helping manufacturers realize full-process quality control and reduce defective products flowing into downstream links.
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