The equipment is equipped with a vibration linear feeding system for automatic feeding, and two 5-million-pixel industrial cameras for synchronous collection of front and back images of components. The AI algorithm can accurately identify common defects such as component polarity, missing parts and tombstoning effects, and supports one-click switching of detection programs for different package sizes. It can process 300 components per minute, which is 15 times more efficient than manual inspection, with a false detection rate of less than 0.4%, and supports automatic counting and data report export.
It supports 01005 to 2010 package SMD components, with a maximum detection speed of 18000 pieces per hour, and is equipped with two 5-million-pixel industrial cameras. It adopts a vibration linear feeding system, with a 7-inch touch operation interface, supporting 110/220V power supply, the overall size of 600*400*800mm and net weight of 120kg. The counting accuracy is ≥99.99%, supporting Wi-Fi remote control and data export.
It is suitable for electronic component manufacturers, SMT processing plants and electronic component distributors, mainly used for incoming material inspection, pre-packaging quality inspection and defective product sorting of small SMD components. It can automatically inspect common SMD devices such as resistors, capacitors and diodes, and can be docked with production lines to realize unmanned sorting operations, improving the efficiency and accuracy of electronic component quality inspection.
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