The core highlights of this product are its high thermal conductivity and excellent insulation protection performance, solving the pain points of low thermal efficiency and insufficient insulation performance of traditional potting adhesives. The thermal conductivity can reach 2.5 W/(m·K), which can quickly transfer the heat generated by electronic components, effectively reducing the working temperature of components and improving the operating stability of equipment. It also has high insulation resistance and dielectric strength, which can effectively isolate current and ensure the safe operation of electronic equipment. It adopts a two-component room temperature curing formula, which can achieve efficient potting without professional heating equipment, and is convenient for construction. The cured胶 layer has excellent moisture and dust resistance, reaching IP67 protection grade, which can effectively resist water vapor, dust and chemical corrosion, suitable for potting protection of industrial-grade electronic equipment.
It is packaged in two components, with a base agent and curing agent ratio of 4:1, and a single package specification of 1kg per kit. The appearance is gray paste, which can form surface curing in 2 hours at room temperature, and reach full curing strength in 24 hours. The thermal conductivity is 2.5 W/(m·K), the insulation resistance is ≥1×10^15 Ω, and the dielectric strength is ≥25 kV/mm, which can meet the insulation and heat dissipation needs of most electronic components. The temperature resistance range is -40℃ to 150℃, which can be used for a long time in high-temperature environments without softening or cracking. It has excellent moisture and dust resistance, and can reach IP67 protection grade after potting, effectively resisting water vapor, dust and chemical corrosion. The shelf life is 12 months, and it needs to be stored in a cool and dry place, avoiding direct sunlight.
It is mainly used for potting protection and heat dissipation of electronic components, including potting of LED lighting modules, heat dissipation packaging of power modules, moisture-proof potting of circuit boards, sealing protection of sensors, protection of industrial control boards and other scenarios. It is suitable for industry customers such as electronic manufacturing factories, LED lighting enterprises and industrial equipment manufacturers, which can effectively improve the heat dissipation efficiency and service life of electronic equipment, reducing the failure rate of equipment. It can also be used for potting protection of new energy vehicle electronic components, adapting to strict industrial and outdoor use environments.
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