It uses high-purity boron nitride ceramic powder filling, with a thermal conductivity of 2.5W/(m·K), while maintaining excellent insulation performance to avoid short circuit risks of electronic components. The cured layer is soft, which can adapt to the slight deformation between components, and can achieve close fitting without additional fixing. It can quickly dissipate the working heat of electronic equipment, improve the operating stability of the equipment, and has excellent chemical corrosion resistance, adapting to complex industrial working conditions.
Each tube has a net content of 100ml, with a tensile strength of 20MPa after curing, 30 Shore A hardness, gray paste appearance, volume resistivity ≥10^12Ω·cm after curing. The working temperature range is -50℃ to 200℃, and the storage validity period is 12 months. It needs to be stored in a cool and dry place below 25℃, avoiding high temperature exposure.
It is suitable for bonding LED lamp heat dissipation modules, fixing computer CPU heat dissipation pads, bonding heating components of industrial frequency converters, thermal bonding of new energy vehicle battery packs and other scenarios. It covers electronic manufacturing, new energy, home appliance maintenance and other industries, providing efficient thermal conductivity and bonding solutions for electronic equipment, improving equipment heat dissipation efficiency and operating life.
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