This product adopts a four-layer composite structure, including anti-static PET layer, high-resistance aluminum foil layer and PE inner layer. It can not only block external oxygen and moisture, but also control the surface static electricity in the range of 10^6-10^9 Ω through the static dissipation layer, avoiding electrostatic breakdown of electronic components. It complies with the ANSI/ESD S20.20 international standard, and can provide static protection test reports. The heat sealing is firm, and the zipper type can be reused, suitable for multiple周转 packaging. Compared with ordinary anti-static bags, it has better oxygen and moisture barrier performance, which can long-term protect sensitive electronic components during storage and transportation.
It has a four-layer composite structure, with anti-static PET layer thickness ≥12μm, aluminum foil layer thickness ≥30μm, and the total thickness covers three specifications of 80μm, 100μm and 150μm. The conventional size supports from 5*8cm chip packaging bags to 50*60cm PCB board packaging. The heat sealing strength is ≥2.5N/15mm, and the single bag can bear a weight of up to 10kg. The static dissipation value complies with the ANSI/ESD S20.20 standard, with an oxygen barrier rate of less than 0.3 cm³/(m²·24h·atm) and a moisture barrier rate of less than 0.05 g/(m²·24h), and can provide third-party ESD test reports.
It is suitable for packaging and transportation of sensitive electronic components such as PCB boards, smartphone parts, lithium batteries, chips and precision instruments. It is widely used in electronic foundries, component dealers, electronic product repair workshops and other scenarios, solving the problem that ordinary plastic packaging cannot protect against static electricity and long-term moisture, ensuring that electronic components will not be damaged by static electricity and environmental factors during storage, transportation and周转.
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