Adopts high-resolution CMOS optical lens to achieve 0.05μm ultra-high measurement accuracy, which can clearly capture the micro-topography of the workpiece surface; non-contact detection mode will not cause any damage to the surface of fragile or precision workpieces such as optical lenses and electronic wafers; supports real-time 3D contour imaging, which can visually display the surface morphology of the workpiece; built-in industrial grade heat dissipation system to ensure stable operation in long-time testing scenarios; the supporting 3D contour analysis software can realize multi-angle observation, error analysis and standard size comparison of the workpiece contour.
The overall size is 650mm×480mm×320mm, and the host weight is 25kg, suitable for fixed placement in the laboratory; the measuring range is 300mm in length and 300mm in width, which can meet the testing needs of most medium-sized precision workpieces; the scan speed can reach 30mm/s, which is 3 times faster than traditional contact profilometers; the optical lens has 5x and 10x interchangeable magnification options to adapt to different surface precision testing requirements; supports remote data transmission through the Ethernet interface, which can realize centralized management of detection data in the laboratory.
It is mainly used for surface contour detection of optical components such as lenses and prisms in the optical manufacturing industry; non-destructive testing of fragile electronic components such as semiconductor wafers and flexible circuit boards; micro-topography detection of biological samples such as cell slides and tissue sections in the biological research field; and precision size detection of precision ceramic parts in the new energy industry.
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