It adopts AI intelligent appearance recognition system, which can automatically identify the sample material and adjust the optimal preparation parameters, completing high-precision sample preparation without manual intervention; the automatic pressure regulation system can adjust the grinding pressure in real time according to the sample hardness, avoiding sample surface deformation and scratches; the constant temperature cooling system can stably control the polishing disc temperature at 25±2℃, preventing the sample microstructure from changing due to overheating; the custom nano wool polishing disc can achieve nanoscale surface finish, meeting the needs of high-end metallographic detection such as SEM and TEM; the cast aluminum integrated molding body has strong stability, reducing the impact of vibration on sample preparation.
The overall size of the machine is 1500mm (length) × 1000mm (width) × 1800mm (height), with a polishing disc diameter of 300mm. The stepless speed regulation range is 50-3000rpm, and the rated input power is 3.5kW. The power supply specification is AC380V 50/60Hz. The net weight of the device is 120kg, applicable to samples with maximum size of Φ150mm × 50mm. The constant temperature cooling system has a temperature control accuracy of ±2℃. It can store 50 sets of custom preparation programs, supports remote data transmission, and the noise level is ≤68dB(A).
It is suitable for semiconductor chip packaging metallographic detection, advanced ceramic material R&D, nano metal material microstructure analysis, aerospace high-temperature alloy failure analysis and other high-end scientific research scenarios. It can prepare samples meeting international high-end metallographic testing standards such as ASTM E112, meeting the needs of high-precision microscope observation.
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