The core technical highlight is the high thermal conductivity of 8W/m·K, with excellent electrical insulation performance, realizing dual functions of heat conduction and insulation at the same time. The high silica fiber substrate has excellent high temperature resistance, and the graphite modified coating improves thermal conductivity and surface flatness, adapting to automated mounting processes. It is soft and easy to bend, can fit irregular heat dissipation surfaces, solving the adaptability problem of traditional hard heat sinks.
The product has a width of 950mm, roll length of 80m, thickness of 0.25mm, thermal conductivity of 8W/m·K, insulation resistance of 1×10^12Ω, warp tensile strength of 380MPa and weft tensile strength of 350MPa, working temperature range of -40°C to 220°C, complies with ISO 14001 environmental management system certification, halogen-free composition, and consistent performance across the entire roll.
It is suitable for heat dissipation insulation pads of power semiconductor modules, heat dissipation backplanes of LED lighting fixtures, heat insulation and insulation layers of new energy vehicle battery packs, and heat dissipation protection of industrial frequency conversion equipment. It can be customized into heat dissipation gaskets of different thicknesses and sizes, meeting the heat dissipation needs of various electronic devices.
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