The core technical highlights include 9μm ultra-fine fibers to ensure uniform dielectric properties, epoxy resin pre-impregnation process to reduce production procedures, UL 94 V-0 flame retardant rating meeting electronic industry safety standards, and IPC certification to ensure compatibility. It solves the signal attenuation pain point in high-frequency PCBs, improves circuit transmission efficiency, and has excellent bending resistance to adapt to SMT automated production processes.
The product has a width of 1020mm, standard roll length of 100m, thickness of 0.18mm, warp tensile strength of 350MPa and weft tensile strength of 320MPa, dielectric constant of 4.2@1MHz, dissipation factor of 0.015, complies with IPC-4101F standard, halogen-free composition and RoHS certification. The density is 200g/㎡, with uniform fiber distribution and consistent performance across the entire roll.
It is suitable for high-frequency PCBs, communication base station circuit boards, smartphone motherboards, automotive electronic control unit (ECU) packaging layers, and insulation protection materials for high-precision sensors. It adapts to SMT automated production processes and meets the reliability requirements of high-end electronic equipment, widely used in 5G communication, new energy vehicles and consumer electronics industries.
Post RFQ
Chat
ALL CATEGORIES