The core advantage of this product lies in its precise aperture control and uniform weaving density, which perfectly matches the epoxy resin impregnation process and improves the interlayer bonding force of PCB substrates. Compared with ordinary fiberglass cloth, the dielectric constant of the 7628 model is stabilized at 4.3±0.1, which effectively reduces the loss in high-frequency signal transmission and solves the industry pain point of signal attenuation in high-frequency PCBs. It also passes UL94 V-0 flame retardant certification and RoHS environmental protection certification, complying with EU electronic industry environmental standards, and has excellent heat resistance to withstand the high-temperature lamination process in PCB manufacturing.
Detailed technical parameters are as follows: the base material is alkali-free E-glass fiber with plain weave; thickness is 0.18±0.02mm; areal density is 200±10g/㎡; tensile strength is 350MPa in warp direction and 320MPa in weft direction; dielectric constant is 4.3 under 1MHz; flame resistance is UL94 V-0; width is 1020mm; roll length is 1000m; complies with IPC-4101 electronic substrate standards; packaged with moisture-proof PE film and hard paper tube to avoid damage during transportation.
It is mainly used in rigid printed circuit board (PCB) substrates, flexible circuit board substrates, insulating layers for semiconductor packaging, communication base station antenna substrates, high-frequency electronic equipment insulating parts and other scenarios. It is suitable for epoxy, phenolic and other resin impregnation processes, and is an indispensable basic insulating material in the high-end electronic manufacturing field, especially suitable for 5G communication equipment, automotive electronic control units and other products with high requirements for insulation performance and dimensional stability.
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