Adopting ultrapure formula, the metal ion and particle impurity content are controlled at the nanometer level, which will not introduce new pollutants. The neutral pH value avoids corrosion to the wafer surface, and the chelating agent can effectively chelate the cleaned metal ions to prevent secondary pollution. It meets the SEMI industry standards, can be recycled and reused through precision filtration systems to reduce production costs, and is suitable for the ultra-clean workshop environment of semiconductor manufacturing with zero VOC emissions.
This is an ultrapure grade cleaning agent, with the content of metal ions (Na+, K+, Ca2+, etc.) all less than 1ppb, and the proportion of impurities with particle diameter >0.1μm is less than 0.01%. The pH value is 7.0±0.2, density is 1.002g/cm³, no flash point (water-based formula). It is packaged in HDPE high-purity dust-proof bottles, with three specifications of 1L, 5L and 20L, and custom large packaging is available according to user needs. It is suitable for CMP cleaning, post-lithography cleaning and other processes.
It is suitable for post-chemical mechanical polishing (CMP) cleaning of semiconductor wafers, photoresist stripping and residue cleaning after photolithography process, pin cleaning before chip packaging, and surface cleaning treatment of LED wafers. It is suitable for automated cleaning equipment in ultra-clean workshops, and can be matched with processes such as ultrasonic cleaning and high-pressure spraying cleaning, meeting the cleaning requirements of wafers below 12 inches. It is widely used in semiconductor manufacturing plants, chip packaging factories and LED production lines.
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