Compared with traditional metallurgical microscopes, this teaching-grade product focuses on optimizing operational friendliness, and is equipped with a quick-change objective turret that allows switching magnification without tools, reducing the threshold of experimental operations. It is equipped with a 6V30W halogen light source with a wide adjustable brightness range, suitable for observing metallographic samples with different contrast. It is equipped with a standard digital camera adapter interface, which can be directly connected to the teaching central control system or personal computer to realize real-time imaging and data storage, solving the pain point that traditional microscopes cannot share observation pictures synchronously. The body is made of lightweight die-cast aluminum alloy, which balances structural stability and portability, suitable for daily mobile use in the laboratory.
The maximum magnification is 1000X, equipped with 4 pieces of plan achromatic objectives (4X/10X/40X/100X oil immersion lens), and comes standard with 10X wide-field eyepieces with a field of view of 18mm. The mechanical sample stage has a size of 150*130mm, with a sample clamp fixing device, supporting X/Y axis two-way movement adjustment with a stroke of 50*50mm. It adopts a coaxial coarse and fine focusing mechanism with a fine adjustment accuracy of 0.002mm. The light source is a 6V30W halogen lamp with continuously adjustable brightness, with a blue filter to improve imaging contrast. The overall size is 320mm (length)*250mm (width)*400mm (height), with a net weight of 8.5kg, and the power supply supports 110/220V AC wide voltage adaptation.
It is mainly used in undergraduate experimental teaching of materials science and metallurgical engineering in colleges and universities, basic metallographic analysis of small and medium-sized metal product testing studios, and introductory metallographic observation for personal scientific research enthusiasts. Typical usage scenarios include: undergraduate junior metallographic sample preparation and imaging experiments, metallographic structure analysis of ordinary carbon steel, preliminary detection of defects in small castings, and surface observation of basic semiconductor wafers.
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