The core feature of this laser displacement sensor is its non-contact measurement principle, which will not cause any damage to the measured surface, making it suitable for detecting soft, thin, or easily damaged materials such as semiconductor wafers and flexible films. It has a ultra-high measurement accuracy of ±0.001mm and a response frequency of up to 10kHz, which can capture real-time dynamic displacement changes. The IP67 protection grade allows it to work stably in outdoor and humid environments, and the compact and lightweight design is easy to install and debug.
This sensor has a measuring range of 0-50mm, with a resolution of 0.1μm and a measurement accuracy of ±0.001mm. It uses a 650nm Class 2 safe red laser, and supports two output modes of RS232 and Ethernet for data transmission. The power supply is 24V DC, and it can work stably in the temperature range of -10℃ to +60℃. The overall dimensions are 90mm × 70mm × 50mm, with a net weight of 0.8kg. It is equipped with a standard mounting bracket, which can be fixed on various equipment and test benches quickly.
This non-contact laser displacement sensor is suitable for semiconductor wafer thickness detection, precision mechanical displacement detection, flexible material thickness monitoring, 3C electronic component assembly positioning, optical lens focusing detection, and non-contact surface profile measurement. It can provide high-precision displacement data for high-end manufacturing industries, helping enterprises improve production accuracy and product quality, and meet the testing needs of various precision processing scenarios.
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