The core advantage lies in the ultra-high purity of 99.9%, avoiding contamination to semiconductor wafers. Compared with ordinary ethylene urea products, its curing reaction rate is increased by 18%, and the insulation resistance of the formed packaging material can reach 1.2×10^15Ω, meeting the strict standards of AEC-Q200 automotive electronic packaging. At the same time, it adopts food-grade inner packaging to avoid cross-contamination during transportation, and adapts to the precise feeding requirements of automated batching systems, solving the extreme purity requirements of the high-end packaging industry.
It appears as pure white crystalline powder with no visible impurities. The melting point range is controlled at 130-134℃, the moisture content is no more than 0.05%, the total content of heavy metals (lead, cadmium, mercury) is ≤1ppm, and the volatile organic compound content is ≤0.02%. The package adopts 25kg steel drum lined with food-grade PE bag, and 500kg ton drum packaging can be customized according to customer needs. The storage environment shall be kept at 15-25℃, relative humidity ≤60%, away from strong oxidants and strong acids and alkalis, and the shelf life can reach 24 months.
It is mainly used in high-end electronic fields such as semiconductor power devices, automotive electronic packaging and 5G base station RF module packaging. As an efficient curing accelerator in epoxy resin packaging technology, it can reduce the curing reaction activation energy, so that the packaging material can be quickly cured at 150℃, shortening the production cycle by 20%. At the same time, it can improve the thermal stability of the packaging material, and the long-term use temperature can reach 150℃, avoiding cracking and debonding of the packaging layer in high-temperature environment, and ensuring the operating stability of the chip under extreme working conditions. In addition, it can also be used for cross-linking modification of high-end optical adhesives to improve the bonding strength and weather resistance of optical components.
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