This electronic-grade high-purity ethylene urea has extremely low impurity content and will not corrode electronic components. It can significantly reduce the curing temperature of epoxy potting glue (from 150℃ to 120℃), reducing energy consumption during the packaging process and improving packaging efficiency by 30%. It passes RoHS 2.0 certification and ISO 9001 quality system certification, solving the industry pain points of traditional curing agents causing yellowing of packaging materials and corrosion of electronic components, while improving the insulation performance and temperature resistance of potting glue.
Purity grade ≥99.9% (electronic grade), heavy metal impurity content ≤1ppm, curing temperature 115-125℃, insulation resistance ≥1×10^14 Ω, temperature resistance range -40℃ to 150℃, storage temperature ≤25℃, dry and避光, packaging specifications include 5kg Boxes and 25kg Pallets, shelf life 12 months, applicable packaging materials include epoxy potting adhesive and silicone packaging material.
It is mainly used for potting of automotive electronic control units, packaging of consumer electronic battery packs and packaging process of semiconductor devices, and adapts to electronic packaging material manufacturers, automotive electronic manufacturers and consumer electronics foundries. It helps improve the environmental protection and reliability of electronic products and meet the global electronic industry's environmental compliance requirements.
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