The resin system is optimized for electronic insulation scenarios, with very low dielectric constant and volume resistivity, solving the signal attenuation problem of ordinary insulating materials in high-frequency electronic scenarios. The flame retardancy reaches UL 94 V-0 grade, complying with the safety standards of the electronic industry. It can be used stably in a 120°C environment for a long time without performance attenuation. The unalkali glass fiber cloth as the reinforcement has good flatness and dimensional stability, which can meet the manufacturing requirements of high-precision electronic parts. The storage life is up to 12 months without low-temperature storage, reducing the storage cost of enterprises.
The reinforcement material is 7628 type unalkali glass fiber cloth, the matrix resin is bisphenol A epoxy resin, the thickness is 0.2-0.5mm optional, the areal weight is 180-300gsm, the resin content is 50±3%, the dielectric strength ≥25kV/mm, the volume resistivity ≥1×10^14 Ω·cm, the flame retardancy grade is UL 94 V-0, the thermal deformation temperature ≥130°C, the adhesive strength ≥2.5MPa, complying with RoHS environmental protection directive requirements. It is packaged in pallet packaging, with each roll weight of 50kg and width of 1020mm/1220mm optional.
It is mainly used in electronic and electrical fields such as PCB substrates, insulating brackets, motor winding insulation, transformer insulating parts and other scenarios. It is compatible with lamination and hot pressing molding processes for electronic composite materials manufacturing, can meet the insulation requirements of high-frequency communication equipment and new energy vehicle electronic control systems, and complies with global environmental protection and safety certification standards of UL and RoHS.
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