The product uses high-purity quartz fiber and medical-grade polyimide resin, with uniform infiltration and regular fiber arrangement, ensuring stable and reliable insulation performance. The insulation resistance is as high as 10^15 Ω, and the dielectric constant is stable at 3.2±0.1 (1MHz), which is suitable for high-frequency electronic signal transmission scenarios. It can withstand a high temperature environment of 250℃ after curing, meeting the reflow soldering process requirements of semiconductor packaging. The volatile content is controlled within 0.3%, avoiding bubbles and defects during the packaging process. It has passed RoHS and REACH environmental certifications, does not contain harmful substances such as halogens, and meets the environmental protection standards of the electronic industry.
After curing, the insulation resistance is ≥10^15 Ω, the dielectric constant is 3.2±0.1 (1MHz), the thickness tolerance is ±0.005mm, with a standard width of 600mm and custom width up to 1200mm available. The storage condition is -10℃ to 5℃ cold storage environment, with a valid storage period of 10 months. The curing process parameters are: preheating temperature 100℃, pressurization pressure 0.1-0.3MPa, curing temperature 200-250℃, holding time 30-60min. It has excellent arc resistance, up to more than 60s, meeting the strict requirements of electronic insulating materials.
It is mainly used in scenarios such as semiconductor packaging substrates, high-frequency communication equipment insulation layers, new energy vehicle battery management system insulation boards and aerospace electronic equipment insulating components. It provides reliable insulation and protection solutions for high-end electronic equipment, helping the electronic industry achieve high-performance and lightweight product upgrades.
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