The core technical advantage is its excellent high-temperature resistance, with long-term use temperature up to 250℃ and good chemical resistance to most organic solvents and acids. The T800 carbon fiber provides ultra-high tensile strength, and the polyimide resin has excellent dielectric properties, making it suitable for electronic and semiconductor applications. It meets ISO 13485 medical device certification and UL safety certification, ensuring compliance with the highest standards of high-temperature industrial and electronic equipment manufacturing. It also has excellent dimensional stability, avoiding deformation under high-temperature working conditions.
The base fiber is T800 carbon fiber with a diameter of 7μm, matched with aromatic polyimide resin system. The thickness range is 0.1-1.2mm, standard roll width is 800mm, and the fiber volume fraction is controlled at 62±2%. The curing temperature ranges from 200 to 250℃, with a modulus of 290GPa and bending strength of 5800MPa. The volatile content is no more than 0.1%, and it needs to be stored in an ultra-low temperature dry warehouse at -20℃ with a shelf life of 12 months. It is suitable for hot press molding and curing oven processes, and can be customized into special specifications according to customer needs.
This prepreg is widely used in semiconductor manufacturing fixtures, high-temperature industrial furnace linings, aircraft engine auxiliary components, medical high-temperature sterilization equipment parts, electronic circuit board reinforcement plates, and high-temperature pipeline structural reinforcement parts. It can also be applied to nuclear power plant high-temperature structural parts and other extreme high-temperature working scenarios.
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