Post RFQ
It has a built-in micro silent vacuum pump that can quickly pump the cleaning chamber to a vacuum environment of 1 Torr, combined with dual-wavelength UV lamps of 185nm and 254nm. The 185nm UV light can decompose oxygen in the air to produce ozone, oxidizing and decomposing organic surface stains, while the 254nm UV light directly destroys organic molecular structures to achieve non-contact cleaning. The equipment has a compact and lightweight size, equipped with a portable suitcase, supporting outdoor mobile operations, and is equipped with a one-button operation panel that can be used without complex training. The whole machine uses an aluminum alloy shell with excellent heat dissipation performance, and is equipped with over-temperature protection and lamp life reminder functions to ensure stable long-term operation of the equipment.

The overall size of the equipment is 25x20x30 Centimeters, and the internal size of the cleaning chamber is 15x15x5 Centimeters, with a maximum load capacity of 1 Kilogram. The working voltage supports 100-240V 50/60Hz AC power, with a total power of 300 Watts, the vacuum degree can be adjusted from 0.5 to 5 Torr, the UV lamp power is 100 Watts, and the lamp life can reach 8000 hours. The net weight of the equipment is 8 Kilograms, and the gross weight is 12 Kilograms. It is equipped with a replaceable UV lamp and a high-efficiency air filter that can filter ozone and impurities generated during the cleaning process. The body is made of aviation-grade aluminum alloy, corrosion-resistant and impact-resistant, meeting CE and RoHS environmental protection certification standards.

It is mainly suitable for optoelectronic chip manufacturing, optical lens production, precision sensor research and development, semiconductor packaging laboratories and other scenarios, and can clean optoelectronic chips, optical lenses, optical fiber connectors, miniature camera modules and other precision optoelectronic components. Typical application scenarios include surface cleaning before chip packaging, removal of fingerprints and oil stains on optical lenses, and micro dust cleaning of miniature sensors, which can effectively improve the optical performance and signal transmission accuracy of optoelectronic components.