This product features a 1Pa ultra-high vacuum degree that air bubble interference during the cleaning process, and a polished quartz cavity to avoid secondary pollution. It meets the ISO 5 class cleanliness standard, and the RCA standard cleaning process adapts to global semiconductor production specifications. The automatic chemical dosing system achieves precise chemical control, reducing human errors. The 2000W high-power ultrasonic array evenly covers the surface of the wafer, avoiding incomplete local cleaning. It is equipped with explosion-proof design and electrostatic protection system suitable for dust-free workshops, solving the pain points of difficult cleaning and pollution control of semiconductor wafers, and improving the production yield of semiconductor devices.
The internal size of the cleaning chamber is 800*600*104mm with a total volume of 50L, equipped with 1MHz high-frequency ultrasonic transducers for precision wafer cleaning. It supports a vacuum degree down to 1Pa, operating voltage of 220V 3-phase 50Hz and total power consumption of 2500W. The net weight is 800kg with gross weight of 900kg, packaged in a 1600*1300*1900mm wooden case. Standard accessories include dedicated wafer fixtures, chemical storage tanks, automatic control system and remote monitoring system. It has passed SEMIC S8 standard and CE certification, meeting the strict requirements of the semiconductor industry.
This semiconductor vacuum cleaning machine is suitable for the cleaning process during semiconductor wafer manufacturing, cleaning lead frames in chip packaging factories, cleaning LED chips, precision cleaning of photovoltaic panels, and cleaning other high-precision electronic components.
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