The core advantage of this machine is its high cleanroom compatibility, which can be used in Class 100 cleanrooms without causing secondary pollution. It integrates deionized water cleaning, ultrasonic oscillation and vacuum dehydration technology, which can effectively remove micro-particles, organic matter and metal impurities on the surface of silicon wafers. The touch screen and remote control dual control mode allows users to easily operate the machine, and the built-in cleaning program can be customized according to different wafer sizes. The particle removal rate reaches ≥99.8%, which meets the high-precision cleaning requirements of photovoltaic and semiconductor industries. It is also equipped with a deionized water recycling system, reducing water resource waste.
The internal cleaning chamber size is 600*500*300mm, which meets the cleaning needs of 6-inch and 8-inch silicon wafers. The cleanroom level is Class 100, which meets the high-precision production requirements of the semiconductor and photovoltaic industries. The maximum working pressure is -92kPa, which can quickly remove residual deionized water from the surface of silicon wafers. The cleaning mode integrates deionized water ultrasonic cleaning and vacuum dehydration, which can achieve one-stop comprehensive cleaning. The power supply is 220V 50Hz, which meets the industrial power supply standards. The net weight is 180kg, and it is equipped with a fixed base to ensure stable operation during cleaning.
This machine is mainly used for precision cleaning of silicon wafers, solar battery pieces, semiconductor packaging parts and other high-tech electronic components. It is suitable for photovoltaic wafer manufacturers, semiconductor packaging plants, solar panel processing plants and other high-tech industries, meeting the strict cleaning requirements of high-precision electronic products.
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