Produced via multiple rounds of molecular distillation and ion exchange purification, this product has impurity levels far below the strict limits of the electronics manufacturing industry, with no detectable residual sulfur or heavy metals that could compromise semiconductor performance. Its ultra-fine particle size ensures uniform coverage on mold surfaces, reducing wear and improving production yield for high-precision electronic components.
This product appears as a white ultra-fine powder with a particle size of 200-300 mesh and a melting point of 72-73℃. It is packaged in vacuum-sealed aluminum foil bags to prevent moisture absorption and contamination, with a net weight of 5 Kilograms per bag. It must be stored in a dust-free, dry environment with controlled temperature, and complies with IPC-A-610 electronic assembly standards.
It is primarily used as a mold release agent in semiconductor chip packaging processes, reducing sticking between encapsulation materials and production molds and improving the yield of high-precision semiconductor components. It also acts as a lubricant in electronic assembly lines, improving the flowability of electronic materials and reducing equipment wear. It is also used as a surface treatment agent for PCBs to improve insulation performance and corrosion resistance. Target customers include semiconductor packaging facilities, PCB manufacturers and electronic component suppliers.
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