This ultra high precision optical vision measuring instrument adopts Zerodur ceramic base, whose thermal expansion coefficient is close to zero, ensuring stable measurement accuracy in different workshop temperature environments, solving the thermal deformation problem of traditional metal bases. It is equipped with coaxial light, dark field light and phase contrast lighting system, which can clearly detect the edge contours of transparent materials and tiny features, solving the detection difficulties of reflective and transparent parts. The AI sub-pixel recognition technology can identify feature sizes of 0.1μm, meeting the high-precision inspection requirements of semiconductor wafers, miniature bearings and precision needles. The Ultra version software supports GD&T full geometric tolerance detection and nano-scale data processing, which is compatible with SEMI standard test report export for semiconductor industry, meeting the compliance requirements of high-end manufacturing scenarios.
Travel Range: X-axis 200mm, Y-axis 150mm, Z-axis 100mm; Measurement Accuracy: ±(1+L/500)μm (compliant with ISO 10360-7); Lens: 5X-10X fixed magnification objective with 0.0001mm linear scale, optional high-magnification adapter up to 500x; Magnification Range:50x to 500x; Lighting: Coaxial LED light, dark field lighting, phase contrast lighting with 0-100% independent brightness control; Software: QMS3D Ultra, AI sub-pixel recognition, 2D/3D nano-scale measurement, GD&T full geometric tolerance detection, SEMI standard report generation; Body: Zerodur ceramic base with aluminum alloy frame, max workpiece load 10kg, net weight 220kg, gross weight 270kg; Power: 100-240V AC, 50/60Hz, 1.2kW; Interface: USB 3.1, Ethernet, optical fiber interface, compatible with all major semiconductor manufacturing software; Operation: Fully automatic CNC control via industrial touch screen, optional wafer chuck integration; Warranty: 3 years parts and labor, 5 years lens calibration.
It is suitable for semiconductor packaging inspection, miniature bearing size inspection, precision medical device needle inspection, PCB micro pin inspection, optical fiber connector size inspection. It can realize sub-micron high-precision inspection, meeting the quality control requirements of high-end precision manufacturing industries, helping enterprises improve product reliability and consistency and reduce defective product rate.
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