Key unique advantages include sub-micron measurement accuracy for micro-scale parts, cleanroom-safe design that complies with industrial semiconductor manufacturing standards, and wafer-compatible worktable that supports standard semiconductor wafer sizes. It solves the pain point of measuring tiny, high-value semiconductor parts with sub-micron precision, enabling quality control for wafer dicing, micro pin headers, and optical component inspection. The instrument supports real-time micro-defect detection and automatic contour recognition for small features down to 1μm in size.
Beyond core attributes, the instrument has a host footprint of 1200mm × 900mm × 1800mm, a maximum workpiece height of 100mm, and a optical field of view ranging from 20mm ×15mm to 2mm ×1.5mm. The laser displacement sensor has a measurement range of 0.1-100mm, and the control software supports wafer map inspection and batch data analysis. It comes with a 36-month standard warranty and on-site cleanroom installation service.
Primary application scenarios include semiconductor wafer manufacturing, microelectronics assembly lines, precision medical device component inspection, optical component production, and MEMS device quality control. It is ideal for measuring dimensions of micro pins, wafer alignment marks, micro gears, and other ultra-small precision parts.
Post RFQ
Chat
ALL CATEGORIES