Made of 1050 high-purity aluminum alloy substrate with aluminum content ≥99.5%, its thermal conductivity reaches 205W/(m·K), far higher than ordinary aluminum alloy plates. The mirror polished surface enhances heat radiation efficiency for better thermal performance, and supports complex shape forming for custom heat sinks. It is free of surface impurities to avoid electronic equipment contamination, and reduces equipment weight by 60% compared with copper heat dissipation materials, meeting EU ROHS environmental standards without toxic substance release.
Alloy grade 1050-O, aluminum content ≥99.5%, thermal conductivity ≥205W/(m·K), thickness range 0.3mm-5.0mm, standard width 1000mm-1500mm, standard length 2000mm-4000mm, tensile strength ≥90MPa, elongation ≥25%, surface roughness Ra≤0.8μm, flatness error ≤0.1mm/m, surface treatment options include mirror, matt and anodized, packaged with antistatic PE film to meet electronic industry dust-free requirements.
It is mainly used for heat dissipation substrates of LED lamps, thermal management aluminum plates of power battery packs, CPU heat sinks of computers, heat dissipation components of industrial motors, heat dissipation plates of solar inverters, heat conduction gasket substrates of electronic equipment and other thermal management scenarios, providing efficient and reliable heat conduction solutions for electronic and industrial equipment.
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