Ultra-Thin Resin

Basic Info

An extremely thin grinding wheel (thickness usually <1mm) made with high-strength resin bond or on a metal hub. Used for precision cutting (e.g., semiconductor dicing) or grinding narrow slots/grooves (e.g., tool fluting, mold corner cleaning). Its core value is minimal kerf loss and high dimensional accuracy.

Key attributes

Origin

China

Abrasive Type

Diamond

Grit Size

#200, #325

Bond Type

High-Precision Resin Bond

Thickness

0.10mm, 0.15mm

Hub Material

Resin hub

Shape Code

1A1

Outer Diameter

20mm

Hole Size

10mm, 20mm

Kerf Width

T + 0.02mm ~ T + 0.05mm

Customer reviews

Elena Rodríguez · Toolroom Manager

We purchased your white aluminum oxide precision wheels for our HSS tool sharpening. The results are outstanding, achieving excellent edge finish and straightness that fully meets precision tool requirements. More importantly, your technical team provided highly professional selection advice, recommending the most suitable grit and hardness combination based on our equipment and material, avoiding common burning issues. Professional products coupled with professional service.

Lucas Miller · Production Supervisor

Your grinding wheels deliver stable hardness—we use brown alumina models for carbon steel grinding, no workpiece burn or vibration issues. The wear resistance is better than our previous supplier, cutting our replacement frequency by 20%. Worth the investment.

Sophie Laurent · Senior Mold Technician

We perform polishing on high-end molds long-term, with stringent surface quality requirements. Your company's polyurethane elastic polishing wheel series was a pleasant surprise. Their hardness grading is very accurate, allowing for a smooth and efficient transition from rough to mirror polishing. The abrasive distribution is even, preventing uneven streaks on the mold surface, and the wheels themselves wear slowly with a long service life. This has become the standard configuration for our polishing process.

Product Description

Product Features:

Extremely high dimensional accuracy and stiffness stability ensure consistent slot/kerf width and sidewall perpendicularity. Requires extremely stringent machine spindle radial and axial runout tolerance (often <0.002mm). Kerf is极小 (接近ing wheel thickness), maximizing material savings on expensive stock.

Product Specifications:

Diameters range from small 20mm dicing blades to over 200mm OD cutting wheels. Thickness can be as precise as 0.1mm. Abrasive is selected based on workpiece: diamond (hard/brittle) or CBN/alumina (metal). Resin wheels are common for precision cutting; metal-hub wheels for high-rigidity slot grinding.

Product Applications:

Dicing and cutting of semiconductor wafers (Si, GaAs, Sapphire). Slicing of magnetic materials (NdFeB, Ferrite). Cutting of精密 ceramic substrates, gemstones. Flute grinding of carbide end mills, drills. Narrow slot and corner cleaning in precision molds (stamping dies).

Basic Info

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Customer reviews

Product Description

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Product Specifications:

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