Ultra-Thin Resin

Basic Info

An extremely thin grinding wheel (thickness usually <1mm) made with high-strength resin bond or on a metal hub. Used for precision cutting (e.g., semiconductor dicing) or grinding narrow slots/grooves (e.g., tool fluting, mold corner cleaning). Its core value is minimal kerf loss and high dimensional accuracy.

Key attributes

Origin

China

Abrasive Type

Diamond

Grit Size

#200, #325

Bond Type

High-Precision Resin Bond

Thickness

0.10mm, 0.15mm

Hub Material

Resin hub

Shape Code

1A1

Outer Diameter

20mm

Hole Size

10mm, 20mm

Kerf Width

T + 0.02mm ~ T + 0.05mm

Customer reviews

Daniel Torres · Maintenance Engineer

These wheels are easy to dress when slightly clogged, and the green silicon carbide type works flawlessly on glass and carbide. Storage tips from your team helped avoid deformation—we’ve stored spare wheels for 3 months with no cracking problems. Reliable choice.

Marcus Weber · Production Manager

For the past six months, our workshop has fully switched to your company's CBN superabrasive wheels for camshaft finish grinding. The most immediate change was a reduction in single-part processing time by approximately 15%, and the wheel has not required dressing yet, with excellent dimensional consistency. Sparks in the grinding zone are noticeably reduced, indicating lower thermal impact on the workpiece. Overall calculation shows that despite the higher initial investment, the cost per part has actually decreased. A truly efficient and long-lasting tool.

Elena Rodríguez · Toolroom Manager

We purchased your white aluminum oxide precision wheels for our HSS tool sharpening. The results are outstanding, achieving excellent edge finish and straightness that fully meets precision tool requirements. More importantly, your technical team provided highly professional selection advice, recommending the most suitable grit and hardness combination based on our equipment and material, avoiding common burning issues. Professional products coupled with professional service.

Product Description

Product Features:

Extremely high dimensional accuracy and stiffness stability ensure consistent slot/kerf width and sidewall perpendicularity. Requires extremely stringent machine spindle radial and axial runout tolerance (often <0.002mm). Kerf is极小 (接近ing wheel thickness), maximizing material savings on expensive stock.

Product Specifications:

Diameters range from small 20mm dicing blades to over 200mm OD cutting wheels. Thickness can be as precise as 0.1mm. Abrasive is selected based on workpiece: diamond (hard/brittle) or CBN/alumina (metal). Resin wheels are common for precision cutting; metal-hub wheels for high-rigidity slot grinding.

Product Applications:

Dicing and cutting of semiconductor wafers (Si, GaAs, Sapphire). Slicing of magnetic materials (NdFeB, Ferrite). Cutting of精密 ceramic substrates, gemstones. Flute grinding of carbide end mills, drills. Narrow slot and corner cleaning in precision molds (stamping dies).

Basic Info

Key attributes

Customer reviews

Product Description

Product Features:

Product Specifications:

Product Applications:

Frequently Asked Questions (FAQ)

Company Profile

General Information

Trade Capability

Company Show