The marble platform and aviation aluminum alloy body effectively minimize thermal deformation, ensuring long-term stable detection accuracy. The 4K telecentric lens greatly reduces perspective error, and can accurately detect micron-level pin spacing and chip dimensions. The RGB adjustable lighting system can adjust color temperature and brightness according to workpiece materials, reducing detection errors caused by reflection. The fully automatic intelligent focusing and AI recognition system can automatically identify workpiece contours and position without manual intervention, solving the pain point that high-precision inspection relies on skilled technicians. It also supports SPC statistical process control and generates quality analysis reports.
The overall dimensions are 750×550×450mm with a net weight of 150kg. It is equipped with a 4K telecentric lens with a magnification of up to 100 times and a resolution of 4096×2160. The effective detection travel is 200mm (X-axis) × 150mm (Y-axis) × 100mm (Z-axis), with a minimum detectable size of 0.005mm and measurement accuracy of ±0.001mm. It supports AC200-240V 50/60Hz power supply, and is configured with a 21.5-inch industrial touch screen, Windows 10 Pro operating system and remote data transmission and cloud storage functions, complying with semiconductor industry standard inspection specifications.
It is mainly applicable to semiconductor packaging factories, microchip manufacturers, precision electronic component manufacturers and scientific research institutions. It can be used to detect parameters such as wafer dimensions, pin flatness and pin spacing of micro connectors, meeting the high-precision quality inspection needs of dust-free workshops, and can also be used for micron-level measurement experiments in scientific research institutions.
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