Optimized for electronic heat dissipation scenarios, this product uses 1050 high-purity aluminum alloy with a thermal conductivity of up to 210W/(m·K), which improves heat conduction speed by more than 15% compared with ordinary solid aluminum bars. It adopts slotting process to increase heat dissipation area by 30%, and supports custom mounting holes, which can directly adapt to different types of electronic components without additional processing. The surface is deburred to avoid scratching the circuit board during installation, solving the industry pain points of insufficient heat dissipation area and poor installation adaptability of ordinary solid aluminum bars, improving the heat dissipation efficiency of electronic equipment by about 25%.
The thickness ranges from 1mm to 10mm, the width ranges from 8mm to 100mm, the length can be custom cut up to 6000mm, the slot depth ranges from 1mm to 5mm, and the slot density can be customized. The thermal conductivity is ≥210W/(m·K), the tensile strength is ≥80MPa, the elongation is ≥28%, and the surface roughness is Ra≤1.6μm. It meets IPC-A-610 electronic assembly standards, passes UL environmental protection certification, and can be custom processed with bending and drilling according to customer needs.
It is mainly used as heat dissipation bars for high-power server power supplies, heat dissipation substrates for high-power LED lighting fixtures, heat dissipation structures of industrial frequency converters, and thermal connectors for new energy vehicle battery management systems. It adapts to high-density electronic assembly scenarios, effectively reducing the working temperature of electronic components and extending equipment service life. It is widely used in the electronic manufacturing and new energy industries.
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