The carton adopts a 3-layer C flute anti-static corrugated structure, with surface resistance controlled at 10^8-10^11 Ω, meeting ANSI/ESD S20.20 electrostatic protection standards, effectively dissipating static charge to avoid performance damage to PCB circuit boards and precision sensors caused by electrostatic discharge. The surface has flame retardant treatment meeting UL94 V-2 flame retardant standards, improving fire safety during transportation. It supports custom anti-static EVA foam lining to accurately fix electronic components and avoid collision damage during transportation. It is made of 100% recycled anti-static kraft paper, meeting the green packaging requirements of the electronics industry. Compared to traditional anti-static plastic packaging bags, this carton provides better structural support, offering both physical protection and electrostatic protection for electronic components.
The carton features a 3-layer C flute composite structure with a total weight of 4.5 Kilograms per piece. The face paper uses 300g/m² anti-static kraft paper, corrugated core is 180g/m² corrugated paper, and base paper is 250g/m² kraft paper. The surface resistance is controlled at 10^8-10^11 Ω, meeting international electrostatic protection standards. It supports custom size adjustments for precision instrument packaging. The hook-and-loop fastener sealing design allows repeated opening and closing, suitable for warehouse turnover of electronic components. It supports custom anti-static EVA foam lining, and maintains stable performance within a temperature range of -10℃ to 50℃, suitable for electronic workshop storage and transportation.
This anti-static corrugated carton is suitable for packaging and transportation of PCB circuit boards, precision sensors, semiconductor chips and other electronic components in the electronics manufacturing industry, electronic component warehouse turnover, laboratory precision instrument packaging and transportation, and anti-static packaging of cross-border electronic goods. It meets the ESD protection packaging standards of the electronics industry, making it an ideal packaging solution for the electronics manufacturing and semiconductor industries.
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